Full Description

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damagefrom the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlifeexposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary toavoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedureand JEP113 defines the labeling requirements.

Product Details

Published: 12/01/2011 Number of Pages: 18File Size: 1 file , 500 KB