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JEDEC JESD22-B118

M00000166

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JEDEC JESD22-B118 SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

standard by JEDEC Solid State Technology Association, 03/01/2011

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This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.