IPC 3408General Requirements for Anisotropically Conductive Adhesives Filmsstandard by Association Connecting Electronics Industries, 11/01/1996
IPC A-610B-CD [ Withdrawn ]Acceptability of Electronic Assemblies on CD-ROMstandard by Association Connecting Electronics Industries, 10/01/1996
IPC D-279Design Guidelines for Reliable Surface Mount Technology Printed Board AssembliesHandbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
IPC AJ-820Assembly & Joining HandbookHandbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
IPC J-STD-013Implementation of Ball Grid Array and Other High Density Technologystandard by Association Connecting Electronics Industries, 08/01/1996
IPC 3406Guidelines for Electrically Conductive Surface Mount Adhesivesstandard by Association Connecting Electronics Industries, 07/01/1996
IPC 6011Generic Performance Specification for Printed Boardsstandard by Association Connecting Electronics Industries, 07/01/1996
IPC TP-1090The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/1996
IPC TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase 11Astandard by Association Connecting Electronics Industries, 07/01/1996
IPC A-610B Amendment 1 [ Withdrawn ]Acceptability of Printed Board AssembliesAmendment by Association Connecting Electronics Industries, 04/01/1996
IPC A-311Process Controls for Phototool Generation and Usestandard by Association Connecting Electronics Industries, 03/01/1996
IPC J-STD-012Implementation of Flip Chip and Chip Scale Technologystandard by Association Connecting Electronics Industries, 01/01/1996