IPC A-610B [ Withdrawn ]Acceptability of Printed Board Assemblies - Incorporates Amendment 1standard by Association Connecting Electronics Industries, 12/01/1994
IPC TR-581IPC Phase 3 Controlled Atmosphere Soldering Studystandard by Association Connecting Electronics Industries, 08/01/1994
IPC TR-582Cleaning and Cleanliness Testing Program for: Phase - Low Solids Fluxes and Pastes Processed in Ambient Airstandard by Association Connecting Electronics Industries, 11/01/1994
IPC ML-960Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 07/01/1994
IPC DR-570AGeneral Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boardsstandard by Association Connecting Electronics Industries, 04/01/1994
IPC CI-408Solderless Surface Mount Connectors Design Characteristics and Application GuidelinesHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994
Composite Metallic Material Specification for Printed Wiring BoardsBook by Association Connecting Electronics Industries, 01/01/1994
IPC OI-645Standard for Visual Optical Inspection Aidsstandard by Association Connecting Electronics Industries, 10/01/1993
IPC MS-810Guidelines for High Volume Microsectionstandard by Association Connecting Electronics Industries, 10/01/1993
IPC TR-551Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Componentsstandard by Association Connecting Electronics Industries, 07/01/1993
IPC S-816SMT Process Guideline and Checkliststandard by Association Connecting Electronics Industries, 07/01/1993
IPC TR-465-1Round Robin Test on Steam Ager Temperature Control Stabilitystandard by Association Connecting Electronics Industries, 01/01/1993