IPC TR-484Results of IPC Copper Foil Ductility Round Robin Studystandard by Association Connecting Electronics Industries, 04/01/1986
IPC TF-870Qualifications and Performance of Polymer Thick Film Printed Boardsstandard by Association Connecting Electronics Industries, 01/01/1987
IPC D-351Printed Board Drawings in Digital Formstandard by Association Connecting Electronics Industries, 08/01/1985
IPC NC-349Computer Numerical Control Formatting for Drillers and Routersstandard by Association Connecting Electronics Industries, 08/01/1985
IPC D-352Electronic Design Data Description for Printed Boards in Digital Formstandard by Association Connecting Electronics Industries, 08/01/1985
IPC TR-485Results of Copper Foil Rupture Strength Test Round Robin Studystandard by Association Connecting Electronics Industries, 03/01/1985
IPC D-322 (R1991)Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel SizesHandbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1984
IPC A-38Fine Line Round Robin Test Patternstandard by Association Connecting Electronics Industries, 09/01/1984
IPC TR-578Leading Edge Manufacturing Technology Reportstandard by Association Connecting Electronics Industries, 09/01/1984
IPC D-422Design Guide for Press Fit Rigid Printed Board BackplanesHandbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1982
IPC TR-460ATrouble-Shooting Checklist for Wave Soldering Printed Wiring Boardsstandard by Association Connecting Electronics Industries, 02/01/1984
IPC TR-481Results of Multilayer Test Program Round Robinstandard by Association Connecting Electronics Industries, 04/01/1981