IPC SM-817General Requirements for Dielectric Surface Mounting Adhesivesstandard by Association Connecting Electronics Industries, 11/01/1989
IPC SMC-TR-001An Introduction to Tape Automated Bonding Fine Pitch Technologystandard by Association Connecting Electronics Industries, 01/01/1989
IPC TR-579Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBsstandard by Association Connecting Electronics Industries, 09/01/1988
IPC DR-572Drilling Guidelines for Printed Boardsstandard by Association Connecting Electronics Industries, 04/01/1988
IPC A-39Small Hole Reliability Round Robin Artworkstandard by Association Connecting Electronics Industries, 09/01/1988
IPC SM-780Component Packaging and Interconnecting with Emphasis on Surface Mountingstandard by Association Connecting Electronics Industries, 03/01/1988
IPC D-390AAutomated Design Guidelinesstandard by Association Connecting Electronics Industries, 02/01/1988
IPC TR-464Accelerated Aging for Solderability Evaluationsstandard by Association Connecting Electronics Industries, 12/01/1987
IPC DW-426Specifications for Assembly of Discrete Wiringstandard by Association Connecting Electronics Industries, 12/01/1987
IPC TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storagestandard by Association Connecting Electronics Industries, 10/01/1987
IPC D-354Library Format Description for Printed Boards in Digital Formstandard by Association Connecting Electronics Industries, 02/01/1987
IPC HM-860Specification for Multilayer Hybrid Circuitsstandard by Association Connecting Electronics Industries, 01/10/1987