JEDEC JESD22-A104DTEMPERATURE CYCLINGstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD22-A101CSTEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TESTstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JS 9703IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliabilitystandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JEP 122EFAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICESstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD82-20AFBDIMM: ADVANCED MEMORY BUFFER (AMB)standard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD 22-A117BELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TESTstandard by JEDEC Solid State Technology Association, 03/01/2009
JEDEC JESD 22-A110CHIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)standard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JEP146AGUIDELINES FOR SUPPLIER PERFORMANCE RATINGstandard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JESD22-B109AFLIP CHIP TENSILE PULLstandard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JESD22-A114FELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)standard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JEP 148ARELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENTstandard by JEDEC Solid State Technology Association, 12/01/2008
JEDEC JESD 78BIC LATCH-UP TESTstandard by JEDEC Solid State Technology Association, 12/01/2008