IPC TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Resultsstandard by Association Connecting Electronics Industries, 01/01/1993
IPC SM-785Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachmentsstandard by Association Connecting Electronics Industries, 11/01/1992
IPC TP-104-KCleaning & Cleanliness Test Program, Phase 3, Water Soluble Fluxes Parts 1 and 2Report / Survey by Association Connecting Electronics Industries, 10/01/1992
IPC FC-232C [ Withdrawn ]Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiringstandard by Association Connecting Electronics Industries, 08/01/1992
IPC MC-790Guidelines for Multichip Module Technology Utilizationstandard by Association Connecting Electronics Industries, 08/01/1992
IPC D-350DPrinted Board Description in Digital Formstandard by Association Connecting Electronics Industries, 07/01/1992
IPC J-STD-003Solderability Tests for Printed Boardsstandard by Association Connecting Electronics Industries, 04/01/1992
IPC SG-141Specification for Finished Fabric Woven from "S" Glass for Printed Boardsstandard by Association Connecting Electronics Industries, 02/01/1992
IPC FA-251Guidelines for Assembly of Single-Sided and Double-Sided Flexible Printed CircuitsHandbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/1992
IPC QF-143Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boardsstandard by Association Connecting Electronics Industries, 02/01/1992
IPC D-330Design Guide ManualHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1992
IPC TR-483Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and IIstandard by Association Connecting Electronics Industries, 03/01/1991